Electronic Manufacture

 SMT:

With 3 HSP / GSM lines we can place BGA’s, TQFP and PLCC devices with ultimate ease – placing 250,000 CPH.

Operating in a totally controlled and monitored ESD environment we can place onto single or double sided PCB’s. Offering prototypes through to batch sizes of 100,000 plus. Our standard lead time is 10-15 days with an option of a quick turnaround in less than 5.

Automated Axial & Radial Through Hole Components

Both Axial and Radial volume Through-Hole assemblies can be handled on our Universal equipment.

AOI

Our state-of-the-art 3D AOI machine enables us to guarantee the quality of your
products. 3D AOI enables precise inspection and measurement of the height dimension of devices on the PCB and provides clear side-view images of ICs and various devices. We are able to see leads and solder joints that were not visible with just a top-down camera. 3D AOI inspects and enables the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations.

We can offer full procurement or we can work on a free issue basis depending on your requirements.

Equipped to offer a complete range of cable, looms and harnesses, using customer drawings, BOM’s or samples. Our experienced staff customise our manufacturing process so as it is best suited for each and every loom requirement.

Utilising a wide range of production and test equipment we can offer an unrivalled level of service to ensure you get a quality product exactly when you need it.

The Pexion Group are experienced in and can provide the following unit or sub assembly services:

Chassis / sub unit assembly
Full unit assembly
Cable and harness assemblies
Functional and ATE testing
Product Configuration
Medium to High volume unit build